United States Patent - Lightweight Miniaturized Integrated Microsatellite Employing Advanced Semiconductor Processing and Packaging Technology (2000)

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Patent Number: 6,137,171
Date of Patent: October 24, 2000

Inventor: Abhay M. Joshi
Assignee: Discovery Semiconductors, Inc.

ABSTRACT

An Integrated microsatellite comprising:

 

• central housingplurality of integrated circuit (IC) wafer means for providing at least individual function, respectivelymeans for mounting said plurality of IC wafer means in said central housing in a spaced apart and parallel relationship providing a stacked array thereof
• a plurality of electrically conductive bus means secured to an interior surface of said housing in longitudinal orientation for conducting power, and a source of reference voltage between said plurality of wafer means, respectively