United States Patent - Lightweight Miniaturized Integrated Microsatellite Employing Advanced Semiconductor Processing and Packaging Technology (2000)

Patent Number: 6,137,171
Date of Patent: October 24, 2000

Inventor: Abhay M. Joshi
Assignee: Discovery Semiconductors, Inc.


A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites.

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